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User Manual for AMD Opteron 6376 2.3 GHz 16-Core G34 Processor Click to enlarge the picture
Contents of the user manual for the AMD Opteron 6376 2.3 GHz 16-Core
- Product category: CPU Processors AMD
- Brand: AMD
- Description and content of package
- Technical information and basic settings
- Frequently asked questions – FAQ
- Troubleshooting (does not switch on, does not respond, error message, what do I do if...)
- Authorized service for AMD CPU Processors
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User manual for the AMD Opteron 6376 2.3 GHz 16-Core contain basic instructions
that need to be followed during installation and operation.
Before starting your appliance, the user manual should be read through carefully.
Follow all the safety instructions and warnings, and be guided by the given recommendations.
User manual is an integral part of any AMD product,
and if it is sold or transferred, they should be handed over jointly with the product.
Following the instructions for use is an essential prerequisite for protecting
health and property during use, as well as recognition of liability on the part of the manufacturer
for possible defects should you make a warranty claim. Download an official AMD user manual in which you will find instructions on how to install, use, maintain and service your product.
And do not forget – unsuitable use of a AMD product will considerably shorten its lifespan!
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Product description The Opteron 6376 2.3 GHz 16-Core Processor from AMD is designed to support workloads for IT organizations of all sizes. This includes server rooms, data centers, traditional IT shops, cloud providers, and more. It has been optimized for virtualization and features a base clock speed of 2.3 GHz, a max clock speed of 3.2 GHz, 16 processing cores, 16MB of shared L3 cache per socket, 1MB of L2 cache per core (for a total of 16MB), a TDP of 115W, and G34 socket compatibility. The Opteron 6376 also supports DDR3-1866/1600 MHz RAM with voltages of 1.25 and 1.35V. Performance - 2nd Generation of AMD's Core Architechture - "Piledriver"
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- Improved performance and performance/watt than the previous generation
- Same power bands and power saving features
- Socket compatible
This helps provides a lower TCO with improved performance. It also helps run applications faster within the same power budget and helps extend the life of your investment by leveraging current socket platforms - Cache and Core Count
- 16 cores, 1 MB of L2 cache per core (16 MB total), and 16 MB of shared L3 cache per socket. This helps improves performance and performance/watt for multi-threaded environments like virtualization, database, and web serving
- DDR3 Frequencies
- Supports DDR3-1600 for typical memory configurations and DDR3-1866 for slightly loaded memory configurations. This helps to improve system performance
- Quad Channel Memory
- Four DDR3 memory channels with max memory bandwidth of up to 51.2 GB/s @ DDR3-1600 with RDIMM, LRDIMM, LV RDIMM, and UDIMM. This can help to increase performance, especially in memory-intensive workloads
- AMD Turbo CORE Technology
- Sixteen cores can boost performance by up to 300 MHz simultaneously when headroom is available. This helps add clock speed for improved performance
- AES Instructions
- AES Instructions provide hardware acceleration for fast and secure data encryption and decryption. This helps improve application performance
- TDP Power Cap
- Thermal design power (TDP) can be set in one watt increments using the BIOS or APML to get the most processing power into a single rack. This helps offer more control over power settings and the flexibility to set power limits without capping CPU frequencies
- C6 Power State
- Core power gating reduces and increases voltage as needed. This helps reduce power costs during times of low usage
AMD-P 2.0 - APML (Advanced Platform Management Link)
- Enables monitoring and controlling of system resources via a Remote Power Management Interface (RPMI) and Precision Thermal Monitor(in APML-enabled platforms). This helps to remotely monitor and control power and cooling
- AMD CoolSpeed Technology
- The server automatically drops into lower power mode if processor's temperature exceeds safe operational limits. Platform providers can safely reduce system fan speeds to deliver greater platform efficiency. This helps protect the processor from overheating
- C1E
- C1E reduces power to the memory controller and HyperTransport technology links. This helps reduce power consumption
- LR-DIMM Support
- This enables extremely dense memory configurations and helps reduce memory-bottlenecks in memory intensive environments such as virtualization
Direct Connect Architecture 2.0 - HyperTransport Technology Assist
- This helps to increase coherent memory bandwidth and reduces latency in multi-node systems by reducing cache probe traffic between cores, helping to improve system efficiency and scalability
- HyperTransport 3.0 Technology (HT3)
- Provides increased system bandwidth between CPUs and I/O, increasing the interconnect rate up to a maximum 6.4 GT/s with HT3. This helps improve system balance and scalability
AMD-V 2.0 Technology - AMD Virtualization (AMD-V) 2.0 Technology
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- Tagged TLB - Efficient switching between virtual machines for better application responsiveness
- Rapid Virtualization Indexing - Hardware-based virtual machine memory management
- AMD-V Technology Extended Migration - Helps enable live migration of VMs between all available AMD Opteron processor generations
- I/O Virtualization - Enables direct device access by a virtual machine for increased integrity and security
This technology is easy to deploy and the larger pool of resources helps enable greater VM consolidation. It is also easy to manage with common architecture helping to simplify the managing of virtual pools. It is also easy to move, as extended migration helps deliver increased flexibility for load balancing and disaster recovery UPC: 730143302715 Table of Contents
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Technical parametersAMD 6376 Specs | | | CPU Model | AMD Opteron6376 | | CPU Socket | G34 | | | | Number of Cores | 16 | | Base Clock Speed | 2.3 GHz | | Maximum Boost Speed | 3.2 GHz | | L2 Cache | 16 x 1 MB | | L3 Cache | 16 MB | | | | Thermal Design Power (TDP) | 115 W |
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